Other > TE-AMPMODU

AMPMODU 50/50 Grid 5-104652-5

Product Type Features

  • Connector Style Receptacle
  • PCB Mounting Orientation Vertical
  • Row-to-Row Spacing 1.27 mm [ .05 in ]
  • Applies To Printed Circuit Board
  • Product Type Connector
  • Boss Without
  • Series AMPMODU
  • Connector Type Connector Assembly


Configuration Features

  • Number of Positions 50
  • Number of Rows 2
  • Electrical Characteristics
  • Voltage (VAC) 30
  • Insulation Resistance (MΩ) 5000


Body Features

  • Hold-Down Post Plating Material Tin over Nickel
  • Hold-Down Post Plating Thickness Tin: 150- Nickel: 50
  • Hold-Down Post Material Copper Alloy
  • Contact Features
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .762 µm [ 30 µin ]
  • Contact Current Rating (A) 4
  • Contact Type Socket
  • Solder Tail Contact Plating Material Tin over Nickel
  • Solder Tail Contact Plating Thickness (µin) 150
  • Underplate Material Nickel
  • Contact Base Material Copper Alloy
  • Termination Features
  • Termination Method to PC Board Surface Mount
  • Mechanical Attachment
  • Mating Alignment With
  • Mating Alignment Type Polarizing Tab
  • PCB Mount Retention With
  • PCB Mount Retention Type Hold-Down Posts
  • Mating Connector Lock Without


Housing Features

  • Centerline 1.27 mm [ .05 in ]
  • Housing Material LCP
  • Housing Color Black
  • Dimensions
  • Height 4.75 mm [ .187 in ]

Download Product Technical Drawing

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