New Products > Molex Imaging Solutions

If you have questions about products, pricing or services, get connected with an Avnet Sales Representative.

MOLEX IMAGING SOLUTIONS

Molex Offering for Embedded Vision Designs

Molex delivers complete interconnect solutions for a number of end markets including industrial, automotive, and medical. Each of these markets leverages embedded vision functionality and Molex is well positioned to address the associated design considerations. Whether moving signal from board to board or one appliance to another, you’ll find it within Molex’s robust suite of solutions. Molex product options are optimized to align with your performance and environmental system requirements. This is beneficial in applications requiring high data transfer rates in harsh environments.

Connect

SlimStack Armor 0.35mm - See SlimStack Armor 0.35mm Details

SlimStack Armor™  0.35mm-pitch connectors deliver up to 3A of extra power through protective metal covers, and provide superior mating guidance and electrical contact assurance for mobile device and other tight-packaging applications.

Features:

  • ultra low profile, short length and narrow width
  • Metal power Armor nails
  • Dual contact design
  • Wide alignment area housing lead-in
  • Housing canopy cover
  • Contact design with audible and tactile mating features
  • Wide vacuum pack-and-place area

Benefits:

  • Offers maximum space savings
  • Prevent damage to the housing even when misaligned during mating. Provides 3.0A of power with superior contact assurance
  • Facilitates mating for more efficient operator assembly
  • Provides an anti-zippering barrier that prevents contact pullout from angled unmating
  • Provides operators with maximum mating assurance
  • Accomodates automatic board placement even with narrow width

Applications:

Mobile Devices

  • Smart Phones
  • Tablet PCs
  • Portable Audio
  • Portable Navigation Equipment

Medical

  • Patient Monitoring
  • Therapeutic and Surgical
Featured Parts
505066
See Part Details
Conn Board to Board RCP 12 – 40 POS 0.35mm Solder ST SMD Embossed T/R
505070
See Part Details
Conn Board to Board PL 16 – 40 POS 0.35mm Solder ST SMD Embossed T/R

Resources

Slim Stack Microminiature

Microminiature High-Speed Stacking Connectors
Molex has the widest range of microminiature board-to-board stacking
solutions in the market. The SlimStack™ product family can achieve signal
speeds up to 20Gbps+ for applications and markets that require faster speeds
and good data integrity.

Excellent Signal Integrity Performance
Engineers today are looking for the connector that gives best electrical signal
integrity performance data as it relates to: 1) insertion loss, 2) return loss 3)
impedance and 4) cross talk. SlimStack high-speed connectors achieve less
than the industry accepted -3dB insertion loss and connectors perform at
-0.5dB at the 20 Gbps speeds.

Good Mechanical and Electrical Reliability
• Housing fitting nails
• End wall cover nails
• Bottom stitch design
• Dual contact
• Stable contact resistance
• Low loses

Proven Leader in the Market
SlimStack Microminiature Connectors have been used in the electronics
market for more than 20 years and are a known leader in microminiature
solutions. Available in 0.35, 0.40, 0.50 and 0.635mm pitch, SlimStack can
support your needs to transmit high-speed data signals for many of the latest
industry standards such as SATA, USB, MiPi, PCIe, HDMI, and the newest

Resources:

USB 3.0 - Request More Info about USB 3.0

High-Durability Class USB 3.0 connectors and cable assemblies provide robust connectivity to support high-speed computing, consumer and embedded vision applications.

USB 3.0 Connectors

Features:

  • Meets High-Durability-Class (5000 mating cycles) requirements of USB 3.0 specifications
  • Meets all USB 3.0 specifications
  • Small footprint
  • High-temperature, halogen-free plastic material used in housing
  • a variety of PCB-mount designs in upright, vertical and right-angle orientations
  • Wide range of contact heights (from 0.36 to 6.09mm)
  • Metal shielding on all sides
  • Detent lock

Benefits:

  • Sustains robust, reliable connectivity over high frequencies of mating and unmating
  • Provides data rates up to 10 times faster than USB 2.0 and ensures devices are sufficiently powered when required
  • Ideal for space-constraint applications
  • Withstands IR reflow temperatures of up to 255°C while maintaining solder-mount compatibility in application processes
  • Give greater design flexibility and higher degree of design freedom to customers
  • For greater vertical space savings in low-profile and other applications
  • Deliver superior shielding against RFI and EMI
  • Securing mating retention

USB 3.0 Cable assemblies

Features:

  • Selection of halogen-free cables
  • Meets High-Durability-Class (5000 mating cycles) requirements of USB 3.0
  • Meets all USB 3.0 specifications

Benefits:

  • Meet environmental sustainability
  • Sustains robust, reliable connectivity over high frequencies of mating and unmating
  • Provides data rates up to 10 times faster than USB 2.0 and ensures devices are sufficiently powered when required
Featured Parts
48406-0003
See Part Details
Universal Serial Bus (USB 3.0) I/O Receptacle, Dual Port Stacked, Right-Angle, Type A, High-Temperature Blue Nylon, 15µ' Gold (Au) Plating, Height 4.13mm
48404-0003
See Part Details
Universal Serial Bus (USB 3.0) I/O Receptacle, Upright 90°, Type A, High-Temperature Blue Nylon, 15µ' Gold (Au) Plating, Height 7.30mm, Contact Height 1.25mm
48395-0003
See Part Details
Universal Serial Bus (USB 3.0) Reverse I/O Receptacle, Right-Angle, Through Hole, Type A, High-Temperature Blue Nylon, 15µ' Gold (Au) Plating, Contact Height 1.00mm
68789-0024
See Part Details
Standard USB 3.0 Type A Male-to-Type B Male 1.0m High Frequency Cable

Resources

Magnetic PDJack - See Magnetic PDJack Details

Based on the RJ45 connector, the magnetic PDJack™ is the first integrated PD (Power Device) Jack in the market to combine a PoE+ PD controller and bridge rectifiers with gigabit magnetics in one connector and provide a complete drop-in, single port solution.

Features:

  • PoE integrated circuit included
  • Bridge rectifiers to accommodate all Power Sourcing Equipment (PSE) types
  • Detection and classification circuitry fully IEEE802.3at compliant
  • Robust ESD and EMI (electro-magnetic interference) design
  • Efficient thermal design
  • Gigabit Ethernet magnetics with common-mode choke
  • Connectors are available in Class 0, 1, 2, 3 and 4
  • Through-hole pins

Matching Benefits:

  • All PoE functionality achieved within connector; no PoE circuitry required on customer PCB
  • No PoE knowledge or experience required by the customer Up to 75% board space saving vs. discrete solution
  • As required for IEEE compliance to support functions of all PoE PSE types
  • Eliminates complex design and testing resulting in faster time-to-market, reduced investment, lower direct and associated purchasing and production costs
  • Fully shielded connector with integrated electro-static discharge (ESD) protection
  • Suitable for wide operating temperature range and passive airflow environments
  • Designed to operate with industry-leading PHY chip vendors at 10/100/1000 Mbps
  • Allows customers to limit the power output of the connector up to 25.5 watts
  • Suitable for wave-soldering

Applications:

  • Telecommunication
  • IP phones/telephony
  • IP cameras
  • Wireless access points
  • Broadband/microwave antenna
  • Commercial
  • Point of sale (POS) devices
  • Home automation interface panels
  • Industrial
  • Control panels (climate control, door access)
  • Human Machine Interface (HMI)
  • Vision systems
  • Sensors
Featured Parts
85791
See Part Details
Conn Modular Jack RCP 8 POS Solder RA Thru-Hole 8 Terminal 1 Port Tray Cat 5e

Resources

MX-Mag Gigabit Jack

Gigabit MX-Mag connectors are robust, high-reliability integrated RJ-45 magnetic jacks providing automated reflow-solder assembly to meet the uppermost customer demands for mechanical, electrical andenvironmental performance whilst offering costadvantages associated with increased production output.

Features:

  • Reflow solder compatible; pin-inpaste and automated pick-andplace options available
  • Optimized design achieves 2,500 mating cycles
  • Robust contact design
  • Customizable, modular connectors with easily added magnetics options in 10/100/1000 Mb speeds and varied pin assignments, circuits, LED and EMI shield tab options
  • Available in temperature ranges 0 to +70°C and -40 to +85°C
  • Multiple packaging options available: tape and reel packaging for pick-and-place applications and tray packaging for standard assembly
  • Footprint and electrical-performance compatibility with the majority of first-tier competitor products

Matching Benefits:

  • Provides high-speed assembly solution without compromising robust through-hole PCB connection
  • Exceeds highest customer requirements for durability and mechanical performance
  • Designed for high-vibration,mission critical applications
  • Supports 2,500 mating cycle requirement
  • Meets demands for custom magnetics to match competitor / PHY vendor requirements. Provides  solutions to meet the majority of right-angle through-hole magnetic jack connector requirements on the market
  • Suitable for a broad range of applications and environments
  • Meets assembly requirements of customers
  • Offers an alternative solution for customers looking to automate assembly processes without the need for PCB redesign

Applications:

Telecommunications/Networking

  • Hubs
  • Servers
  • Printers
  • Access Point

Industrial

  • PLC Controllers
  • Network Interfaces
  • Motor Control

Infrastructure

  • Access Point

Resources

Molex

Watch the Chalk Talk

Learn how Molex’s products connect your embedded vision designs.

 

Play Fullscreen

Embedded Vision Solutions

The Embedded Vision Alliance's primary goal is to inspire and empower hardware and software product creators to use computer vision...

View More