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Taiyo Yuden  Bluetooth® Smart

TAIYO YUDEN Bluetooth® Smart Modules

Bluetooth® Low Energy Modules from TAIYO YUDEN are ideal for applications that require wireless communication with low-energy consumption. The EYSHJN series, EYSGCN series, EYSGJN series, EYAGJN, and EYSHCN series Bluetooth® Low Energy Modules with Nordic nRF52832, nRF51822, or nRF51422 are cost effective modules with integrated high performance antennas. The EYSGCN and EYSHCN series' small outline of 9.6 x 12.9 x 2.0 mm and the EYSHJN, EYSGJN and EYAGJN series' ultra-small footprint of 5.1 x 11.3 x 1.3 mm make them suitable for wearable devices, healthcare devices, home automation, and other applications. All Bluetooth® Low Energy Modules from TAIYO YUDEN are FCC/ISED/Japan certified, cost-effective, and are a faster time-to-market solution.

EYSHJNZXZ - See Part Details

  • Frequency: 2402 to 2480 MHz
  • Output power: +4dBm typ.
  • Single power supply: 1.7 – 3.6V
  • Single Mode Bluetooth® Low Energy Slave/Master
  • Integrated System Clock
  • Integrated high performance pattern antenna
  • ARM Cortex M4F 32bit processor and 512KB flash and 64KB RAM
  • Interface: SPI, UART, I2C, I2S, PDM and 12bit ADC
  • Outline: 5.1 x 11.3 x 1.3 mm MAX
  • Bluetooth® and Japan, FCC, IC qualified
  • CE conducted test report available
  • RoHS compliant / Complete Lead Free

Associated Kits & Boards
EBSHJNZXZ (board)
EKSHJNZXZ (kit)

EYSHCNZXZ - See Part Details

  • Nordic nR51822
  • Frequency: 2402 to 2480 MHz
  • Output power: +4dBm typ.
  • Single power supply: 1.7-3.6V
  • ARM® Cortex® M4F 32bit processor
  • 512 KB Flash and 64 KB RAM 
  • FCC/ISED/Japan certified
  • RoHS-compliant and lead free
  • Interface: SPI, UART, I²C, I²S PDM, and 12-bit ADC
  • Operating temperature -25° to 75°C

Associated Kits & Boards

EKSGCNZWY (kit)
EBSGCNZWY (board)

EYSGCNZWY - See Part Details
EYSGJNZWY - See Part Details
EYAGJNZXX  - See Part Details

  • Bluetooth® 4.2 low energy
  • Bluetooth® Smart peripheral/central roles
  • Nordic nRF51822
  • Integrated high performance chip antenna
  • FCC/ISED/Japan certified
  • Outline: 9.6 x 12.9 x 2.0 mm with 1 mm pad pitch

Associated Kits & Boards

EKSHCNZXZ (kit)
EKSGJNZWY (kit)
EKAGJNZXX (kit)
EBSHCNZXZ (board)
EBSGJNZWY (board)
EBAGJNZXX (board)

Bluetooth® Smart Applications

  • Smart meters
  • Car Electronics
  • Home security and sensors
  • Home automation
  • Cameras
  • Wearable devices
  • Health Check Monitors
  • Computer Peripherals

Wi-Fi Modules

TAIYO YUDEN Wi-Fi modules feature Marvell Semiconductor chipsets and are ideal for a wide range of applications, including smart phones and peripheral devices.  Evaluation boards and evaluation kits are available for easier design. Design support for antennas is available. Applications include use in Smart TVs, gaming platforms, tablet PCs, and smart phones.

WYSACVLXYXX - See Part Details

  • Chipset: Marvell MW300
  • SMD type module. with trace ANT  
  • IEEE802.11b/g/n conformity.
  • Interface : UART, SPI, I2C
  • Built-in WLAN front end, Flash Memory, Xtal, Power circuits
  • Security: WPA-2 using AES/CCMP along with legacy security features
  • Advanced Wi-Fi features: 802.11n, Micro-AP mode, client mode, WPS
  • Outline: 21.4 x 14.0 x 2.4max mm

WYSAAVDX7 - See Part Details

  • Chipset: Marvell 88W8787
  • 11bgn          
  • FCC/ISED/Japan Qualified
  • Built in EEPROM, X'tal, 2G-PA, BPF
  • Interface: SDIO
  • 802.11 a/b/g/n
  • Size: 35.0 x 15.0 x 2.9 mm

WYSBHVGXG - See Part Details

  • Chipset: Marvell 88W8887
  • SMD type module.
  • IEEE802.11ac/a/b/g/n 1x1 conformity. Data rates up to MCS9(433.3Mbps)
  • BT4.2 (supports Bluetooth® Low Energy). Class2 supports.
  • Near Field Communication (NFC) connectivity technology, per NFC Forum specification
  • Interface : SDIO3.0, PCM, UICC/SE, GPIO
  • Built-in Diplexer, 2G-PA, 5G-PA, 5G-LNA, OTP, X`tal, DC/DC Power
  • Security: TKIP, WEP, AES, CCMP, CMAC, WAPI, WPA/WPA2(64bit/128bit)
  • Outline: 12.6 x 8.9 x 1.9(Max) mm

WYSBCVGX7/WYSBCVGXA - See Part Details

  • Chipset: Marvell 88W8787
  • 11 bgn
  • Built-in EEPROM, 2G-PA,Crystal, BPF
  • Interface: SDIO
  • 802.11 a/b/g/n
  • Size: 9.0 x 8.8 x 1.35 mm

Resources

TAIYO YUDEN

Wireless Module Bluetooth® Low Energy Overview

Download TAIYO YUDEN’s Wireless Module Bluetooth® Low Energy Overview. This overview gives you information on TAIYO YUDEN’s entire Line-Up!

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TAIYO YUDEN

EYSHJNZXZ Bluetooth® Low Energy

Learn more about EYSHJNZXZ Bluetooth® Low Energy for many applications, including: heart rate monitors, thermometers, mobile accessories and More!

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Taiyo Yuden

Taiyo Yuden Wireless and GPS Modules

Learn more about Taiyo Yuden’s Wireless and GPS Modules

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WBSBHVGXG EVB Manual

Download Taiyo Yuden’s WBSBHVGXG EVB Manual for wireless LAN and bluetooth module evaluation board

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Taiyo Yuden

WBSACVLXY EVB Manual

Download Taiyo Yuden's WBSACVLXY EVB Manual for wireless LAN module evaluation board.

Download Now