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TE Connectivity Interconnect Solutions

TE Connectivity: New 28 Gbps High-density, High-speed Interconnect Solution

The zSFP+ (SFP28) pluggable I/O interconnect was designed to quickly and easily upgrade SFP/SFP+ connectors from current 10-16 Gbps speeds to future 28 Gbps speeds. The product is backwards-compatible to SFP+ products-in footprint, mating interface and cage dimensions- to allow for easy drop-in replacement within current communication systems.

For newer equipment designs, the zSFP+ (SFP28) interconnect can support either 10 Gbps Ethernet or 16 Fibre Channel Gbps data rates-while accommodating a long-term upgrade path for 28- or potentially 40- Gbps performance. This equates to long-term cost savings as the product eliminates the need to fully redesign or reinstall communication equipment for higher performance.

The zSFP+ (SFP28) interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32G (28.05 Gbps line rate). The entire product family is offered as a dual source option with Molex Incorporated.

Key Features

  • Data Rates:
    • 28 Gbps up to potentially 40 Gbps
  • Surface-mount connector design
  • Press-fit cages for one-step, easy PCB placement
  • Coupled, narrow-edged, blanked- and formed-contact geometry and insert molding for superior signal integrity, mechanical and electrical performance
  • Backwards- compatibility: shares same PCB footprint, mating interface and cage dimensions with the SFP+ connector
  • EMI containment offered in either elastomeric gasket or spring finger options
  • Single-port high cages (1xN) for design flexibility / accommodates belly-to-belly applications to increase density while saving PCB space
  • Offers stacked cages in 2x1, 2x2, 2x4, 2x6, 2x8, 2x10 and 2x12 port configurations
  • Heat sinks, LEDs and plating choices offered for various design specifications
  • Mechanical:
    • Mating Force: 25N
    • Unmating Force: 11.5N
    • Durability (min.): 250 cycles
  • Electrical:
    • Voltage (max.): 120V max
    • Current (max.): 0.5 A
    • Dielectric Withstanding Voltage: 300V AC between contacts
  • Physical:
    • High-temperature thermoplastic housing (glass filled, UL 94V-0 black)
    • High-performance copper alloy contacts
    • Nickel underplating; Tin plating on solder tail area; Gold plating on mating area
    • Operating temperature: -40 to 85 ºC


  • Telecommunications
    • Cellular Infrastructure
    • Access routers and switches
    • Servers
    • Switches
  • Data Center
    • Servers
    • Storage
  • Medical
    • Medical diagnostic equipment
  • Networking
    • Network Interface
    • Switches
    • Routers
  • Test and measurement equipment
TE Connectivity


The zSFP+ (SFP28) interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32G

Part Details